Chip analysis website ChipWise has just cracked open the processors inside the iPhone 16 and iPhone 16 Pro to take a look inside.
A18 and A18 Pro chips are the new generation of Apple processors that have been included in new iPhone models this year. Both chips are based on 3nm lithography with V9 logo architecture and TSMC packaging technology.
ChipWise
According to ChipWise, the Taiwanese chipmaker uses the InFO-PoP (Integrated Fan-Out Package-on-Package) packaging method, which has been consistent over the past few years. In this method, the DRAM module is stacked directly on the chip and incorporates high-density RDL (signal distribution) layers and TIV (vertical interconnect) lines to reduce overall chip dimensions while maintaining strong thermal and electrical stability. to be One of the key advantages of this packaging method is its flexibility, as the DRAM can be easily replaced.
ChipWise
The A18 chip is based on a more advanced architecture than its previous generations and uses the optimized three-nanometer (N3E) manufacturing process. This chip has a 6-core CPU consisting of two powerful cores and four low-power cores for everyday tasks, thus ensuring optimal performance and energy efficiency. The GPU part of the chip consists of five cores and the NPU part consists of 16 cores.
The A18 Pro has the same architecture as its smaller sibling in terms of CPU cores, but is optimized for higher processing speeds. The GPU on the A18 Pro appears to be significantly more powerful, offering a 6-core design that provides better graphics performance for 3D rendering, augmented reality, gaming, and other graphics tasks. In fact, the main difference between the two new Apple chips is related to the number of GPU cores.
The neural processing engine in the A18 Pro has also been enhanced, allowing it to perform better in local AI-based processes, making it ideal for users with higher needs.
